{
  "version": "https://jsonfeed.org/version/1.1",
  "title": "SALAR Technologies LLC — Technical Engineering Updates",
  "home_page_url": "https://www.salartechnologies.com/",
  "feed_url": "https://www.salartechnologies.com/feed.json",
  "description": "Public technical material on defense electronics, semiconductor supply-chain risk, provenance, mission-critical reliability, AI-fabric validation, and AI infrastructure assurance.",
  "items": [
    {
      "id": "https://www.salartechnologies.com/category-authority.html",
      "url": "https://www.salartechnologies.com/category-authority.html",
      "title": "SALAR Technical Authority Hub",
      "summary": "Technical topic hub covering defense electronics SCRM, semiconductor provenance, AI-fabric validation, mission-critical electronics reliability, and evidence-to-decision engineering."
    },
    {
      "id": "https://www.salartechnologies.com/defense-electronics-supply-chain-risk.html",
      "url": "https://www.salartechnologies.com/defense-electronics-supply-chain-risk.html",
      "title": "Defense Electronics Supply-Chain Risk Management",
      "summary": "Lower-tier dependency mapping, shared-node exposure, fab/OSAT concentration, qualification constraints, provenance evidence, and mitigation logic."
    },
    {
      "id": "https://www.salartechnologies.com/semiconductor-provenance-counterfeit-risk.html",
      "url": "https://www.salartechnologies.com/semiconductor-provenance-counterfeit-risk.html",
      "title": "Semiconductor Provenance & Counterfeit-Risk Decision Support",
      "summary": "Source pedigree, chain of custody, lot consistency, technical evidence, source-confidence reasoning, and auditable disposition."
    },
    {
      "id": "https://www.salartechnologies.com/ai-fabric-validation-assurance.html",
      "url": "https://www.salartechnologies.com/ai-fabric-validation-assurance.html",
      "title": "AI Fabric L1-L3 Validation & Reliability Assurance",
      "summary": "Physical and optical health, Ethernet/link behavior, routing/path evidence, workload correlation, failure localization, and traceable acceptance criteria."
    },
    {
      "id": "https://www.salartechnologies.com/mission-critical-electronics-reliability.html",
      "url": "https://www.salartechnologies.com/mission-critical-electronics-reliability.html",
      "title": "Mission-Critical Electronics Reliability Engineering",
      "summary": "Derating, worst-case electrical and thermal stress, design margin, manufacturability, mission profiles, and failure-evidence closure."
    }
  ]
}