Filed and public-safe areas

Patent Portfolio

Patent 1 | Filed; Patent Pending

Board Design Reliability Analysis Checklist Guidelines

U.S. Patent Application No. 18/311,244

Structured engineering methods for board-level reliability analysis across component selection, circuit design, placement, layout, and manufacturing review.

Patent 2 | Filed; Patent Pending

Profile-Based Ethernet Connectivity for Multi-Lane SoC Devices

U.S. Patent Application No. 19/433,978

Governed connectivity profiles for complex multi-lane SoC environments and repeatable interconnect behavior.

Patent 3 | Filed; Patent Pending

Graph-Based Multi-Tier Semiconductor Supply-Chain Risk Scoring and Closed-Loop Mitigation

U.S. Patent Application No. 19/535,459

Graph-based visibility and decision support for multi-tier sourcing risk, provenance, and mitigation priorities.

Patent 4 | Filed; Patent Pending

Closed-Loop Manufacturing Stability Systems and Methods for Multi-Domain Control Production

U.S. Patent Application No. 19/534,285

Distributed control and manufacturing stability logic for detecting excursions and preserving throughput and trust.

Patent 5 | In Progress

AI-Certified Lithography Control

Pre-filing invention | public-safe summary only

High-level positioning around traceable confidence, bounded corrective action, and certifiable process-window control.

Public disclosure note: this page describes filed or public-safe technical areas only. 6G is intentionally excluded from the current public packet.